Multifunctional SMD Placement Machine with 3D MID Feature
Yamaha S20 SMD Machine
Get unparalleled flexibility with 3D MID* array, multi-functional features and support for Davasa PCB sizes
- Developed for 3D MID
- Ability to use large boards
- Ability to use a wide range of components and high feeder capacity
- Great flexibility and quick & easy installation
*3D MID: molded internal connection device
Yamaha S20
Model | S20 |
Board size | Min. L 50 x W 30 mm to Max. L 1,830 x W 510 mm (Standard L 1,455) |
|---|---|
Board size | Min. L 50 x W 30 mm to Max. L 540x W 510 mm |
Board thickness | 0.4 – 4.8mm |
Board flow direction | Left to right (Std) |
Board transfer speed | Max 900 mm/sec |
Placement speed | 0.08 sec/CHIP (45,000 CPH) |
Placement accuracy A (μ+3σ) | CHIP +/- 0.040mm |
Placement accuracy B (μ+3σ) | I.C +/- 0.025mm |
Placement angle | +/- 180 degrees |
Z axis control/ Theta axis control | AC servo motor |
Component height | Max 30 mm *1 (Pre-placed components: max 25 mm) |
Applicable components | 0201 mm – 120 x 90 mm, BGA, CSP, connector, etc. |
Component package | 8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 180 types (8 mm tape), 45 lanes x 4 |
Transfer height | 900 +/- 20mm |
Machine dimensions, weight | L 1750 x D 1750 x H 1420 mm, Approx. 1450kg |
| *1) Board thickness + Component height = Max 30mm Some specifications and parts of the external appearance are subject to change without notice. | |
