Multifunctional System with 3D MID

Yamaha S10 SMD Pick and Place Machine

With SMD Typesetting, you have a typesetting platform like no other in the world with its 3D MID* and multifunctional features.

*3D MID: molded internal connection device

Model	S10
Board size (with buffer unused)	Min. L 50 x W 30 mm to Max. L 1,330 x W 510 mm (Standard L 955)
Board size (with input or output buffers used)	Min. L 50 x W 30 mm to Max. L 420x W 510 mm
Board size (with input and output buffers used)	Min. L 50 x W 30 mm to Max. L 330x W 510 mm
Board thickness	0.4 – 4.8mm
Board flow direction	Left to right (Std)
Board transfer speed	Max 900 mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08 sec/CHIP (45,000 CPH)
Placement accuracy A (μ+3σ)	CHIP +/- 0.040mm
Placement accuracy B (μ+3σ)	I.C +/- 0.025mm
Placement angle	+/- 180 degrees
Z axis control/ Theta axis control	AC servo motor
Component height	Max 30 mm ^*1 (Pre-placed components: max 25 mm)
Applicable components	0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
Component package	8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8 mm tape), 45 lanes x 2
Transfer height	900 +/- 20mm
Machine dimensions, weight	L 1250 x D 1750 x H 1420 mm, Approx. 1150kg
*1) Board thickness + Component height = Max 30mm Some specifications and parts of the external appearance are subject to change without notice.