Vapor phase soldering

Vapor phase and vacuum reflow soldering

Solder to aerospace technology quality standards with vapor phase and vacuum soldering technology. Achieve unprecedented homogeneous temperature distribution in a zero oxygen environment in an inert gas atmosphere without nitrogen expense.

Create a virtually infinite number of void-free soldering temperature profiles with the patented SVP™ (Soft Vapour Phase) technology of IBL vapor phase furnaces . Get the widest variety of process settings ever.
Lowest possible soldering temperatures. Minimum temperature difference across the board. Zero oxygen. Zero void (solder bubble).
Solder at the lowest possible soldering temperatures. Eliminate component overheating and temperature differences (delta T). Solder with exceptional quality in zero oxygen environment in inert gas vapor without using nitrogen. Also achieve zero void ratio under vacuum. Reduce your electrical energy costs in reflow furnace by 50%.

IBL-Tech Vapor Phase Machine Models